The TXRF 8300W is fully compatible with SMIF 200mm, Open Cassette 200mm and FOUP 300mm standards and follows SECS/GEM automation. It meets factory-required host communication protocols and is fully compliant with SEMI standards. It works at atmospheric pressure for the highest throughput in FAB environment.
It provides Full Wafer Analysis and Mapping and is based on the non-destructive TXRF technique (Total X-Ray Fluorescence under X-ray irradiation at grazing incidence). The technique is totally quantitative without the need for specific standards, and its non-destructiveness allows re-measurements when needed or for further investigations.
The instrument operates at atmospheric pressure guaranteeing the highest uptime, reliability and stability and is straightforward to use.