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In-line Tools:
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Shallow
Probe:
High throughput Fab-line tool for composition and thickness
measurements of ultra-thin structures. Full wafer mapping & product
wafer analysis.
- DOPANT & IMPLANTS: USJ dopant in Si, EPI-SiGe, SOI, PLAD,
- DEPOSITED FILMS: Thickness & composition of gate oxide,
oxynitride, high-k, metal, barrier and cap layers, interconnect structures.
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TXRF 8300W:
High throughput Fab-line tool for quantitation of trace element contamination on the
surface of the semiconductor wafers. Based on non-destructive
TXRF
technique. Used for monitoring WAFER CLEANLINESS and METALLIC
CONTAMINATION level. The TXRF 8300W provides Full Wafer Mapping,
straight TXRF and measurement of VPD (Vapor Phase Decomposition)
droplets.
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Near-line or through-the-wall Tools:
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IMS Wf-SC Ultra: automated
magnetic sector SIMS for implant dose matching, junction
depth measurement, process development (characterization of implant, deposited layers,
annealing,...) and failure analysis. The IMS Wf is optimized for trace element depth profiling of ultra-thin structures
with high sensitivity (down to ppb atomic concentration) and high Depth Resolution.
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SIMS 4600: full-wafer quadrupole SIMS for ultra shallow implant dose matching and junction depth. Ultra
Low Energy dopant depth profiling with unsurpassed ease of use, flexibility and insulator
analysis. Extremely stable for automated batch analysis. In single gun,
normal incidence configuration, it is the SIMS of choice for full-wafer analysis
and monitoring with unattended chained operation.
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IMS 7f: magnetic sector
SIMS
for Depth Profiling with high sensitivity
(down to ppb atomic concentration) and 2D or 3D imaging of trace
elements. Widely used for dopant implant dose matching, junction
depth measurement, process
development (characterization of implant, deposition, annealing,...),
failure
and light element analysis.
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SIMS 4550: quadrupole
SIMS for Ultra
Low Energy profiling with unsurpassed ease of use, flexibility and
insulator
analysis. Extremely stable for automated batch analysis. By all
standards the Reference in quadrupole SIMS for next generation
semiconductors.
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