IMS Wf/
SC Ultra: depth resolution improvement with an eucentric rotating stage
The
development of surface roughness during sputtering of solids dramatically
limits the depth resolution for in-depth analysis of polycrystalline materials,
such as metals. The eucentric rotating stage of the IMS Wf & SC Ultra
significantly reduces this effect. Combining low impact energies and sample rotation optimizes the conditions
for high-depth resolution profiling in metal thin-films.
The IMS Wf-SC Ultra rotating stage is mechanically eucentric: it can rotate
around any point of the sample (the area accessible for analysis is 300mmx300mm
without rotation and 250mm diam. with rotation). Its precision allows to
run profiles from small craters (100-200µm raster) without any special
care.
The figures below compare a Cu layer structure on Si, profiled with and without sample rotation. The sample rotation during the analysis results in a marked improvement of the profile shape: flat signal inside the layers and sharper interfaces.
1) Without sample rotation:
2) With sample rotation:
