CAMECA IMS Wf reproducibility and full wafer SIMS mapping

IMS Wf reproducibility and Full Wafer mapping

1) Reproducibility

The IMS Wf is designed to load a full 300 or 200mm wafer, or several smaller wafers on one sample holder.
The high reliabilty 300mm x 300mm stage (also used in the CAMECA Shallow Probe LEXFAB-300 fab metrology tool) permits to analyze any point of the wafer.

The IMS Wf-SC Ultra have been developped with the objective to be fully automated, working with a recipy mode: the full or partial instrument setting is loaded from a file and applied to the instrument. The following examples give a feeling of the impressive stability and reproducibility of the instrument, achieved in automated mode, including autofocus for Z sample adjustment and in-situ crater depth measurement.

Full-wafer analysis of boron implant: twelve profiles are superimposed, showing the excellent reproducibility of the measurements. Inlet: same data in linear scale.

Nine ultra-shallow arsenic profiles superimposed in linear scale, showing the superior reproducibility of the measurements.

2) Full wafer mapping

Thanks to this high stability and reproducibility and coupled with its full wafer analysis capability, full wafer mapping can be obtained on the CAMECA IMS Wf with a good throughput (typically 10 minutes per point). The two examples below show maps reconstructed from 25 and 9 spots across the wafers.

25 point mapping over a 200 mm wafer.

N dose in oxynitride.

9 point mapping over a 300 mm wafer.
B dose for a 200 keV implant.